| Layer: | 1-36L (TG135 TG150 TG170 TG180) |
| Brand of Material: | CEM-1CEM-3,ITEQ ShengYi,KB,Rogers,ISOLA,Venteck,Polymide,Ceramics |
| Copper Thickness: |
Inner:0.5oz 1oz 2oz 3oz 4OZ 5OZ Outer:1oz 2oz 3oz 4oz 5OZ 6OZ |
| Surface Finishing: |
Lead Finishing:HASL HASL+Gold finger Lead Free Finishing:Lead Free HASL,Immersion Gold,Immersion Silver,Immersion Tin |
| Finish Thickness: | 0.4mm-4.0mm |
| Min Hole size: | 0.20MM |
| Soldermask Color:Glossy : |
Green Red White Black Blue Yellow Blue Orange Purple Gray Matt: Green Blue Black |
| Silkscreen Color: | Black White Yellow |
| Special Process: |
Impedence Board(Request as +/- 10%) High TG,Halogen-free,/Halogen-free&High TG board |
| Max Board Size: | 1-2layers: 1000mm * 600mm multilayer board: 600* 600mm |
| The width of wire: | Min. Width:Gold board:0.075mm HASL board:0.10mm |
| The Space of wire: | Min. Space:Gold board:0.075mm HASL board:0.10mm |
| Accept Standard: | IPC class 2 IPC class 3 UL ISO9001 |
| Gold plating board: | nickel coating thickness:. > or =2.5u |
| Gold layer thickness: | 0.05-0.1 um or by customer requirements |
| HASL board: | HASL tin thickness: > or =2.5-5. |
| Milling: |
The Min. distance from line to the edge: 0.15mm The Min. distance from hole to the edge: 0.2mm The Min. tolerance for outline: +/- 0.12mm |
| Chamfer Angle: |
30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm |
| V Scoring: Angle: |
30 degrees, 35 degrees, 45 degrees Depth: Board thickness 2/3 Min. size:80mm * 80mm |
| general test: |
Maximum test area: 400mm * 500mm Maximum test points: 8000 points Maximum test voltage: 300V Maximum insulation resistance 100M |
| resistance welding: | 85--105 C/ 280 – 360C |
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